Granted Patent
Utility
US 6,316,332 · App. 09/201,170
Method for joining wafers at a low temperature and low stress
Inventors:
Yu-Hwa Lo, Jizhi Zhang
Patented Case
View Patent ↗
Granted: Nov 13, 2001
Filed: Nov 30, 1998
Inventors
Yu-Hwa Lo
Jizhi Zhang
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.