Granted Patent
Utility
US 6,316,359 · App. 09/498,613
Interconnect structure in a semiconductor device and method of formation
Inventor:
Cindy Reidsema Simpson
Patented Case
View Patent ↗
Granted: Nov 13, 2001
Filed: Feb 4, 2000
Inventor
Cindy Reidsema Simpson
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.