Granted Patent
Utility
US 6,316,837 · App. 09/200,937
Area array type semiconductor package and fabrication method
Inventor:
Chi-Jung Song
Patented Case
View Patent ↗
Granted: Nov 13, 2001
Filed: Nov 30, 1998
Inventor
Chi-Jung Song
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.