IP Library › Granted Patent US 6,320,213
Granted Patent Utility
US 6,320,213 · App. 08/994,089

Diffusion barriers between noble metal electrodes and metallization layers, and integrated circuit and semiconductor devices comprising same

Inventors: Peter S. Kirlin, Scott R. Summerfelt, Paul McIntryre
Patented Case View Patent ↗
Granted: Nov 20, 2001 Filed: Dec 19, 1997
Inventors
Peter S. Kirlin
Scott R. Summerfelt
Paul McIntryre
Assignee (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.

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Quick Facts
Patent No.
US 6,320,213
App. No.
08/994,089
Filed
1997-12-19
Granted
2001-11-20
Kind
A