Granted Patent
Utility
US 6,320,754 · App. 09/369,898
Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package
Inventors:
Walter Dauksher, Pedro F. Engel
Patented Case
View Patent ↗
Granted: Nov 20, 2001
Filed: Aug 6, 1999
Inventors
Walter Dauksher
Pedro F. Engel
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.