IP Library Granted Patent US 6,322,206
Granted Patent Utility
US 6,322,206 · App. 09/216,606

Multilayered platform for multiple printhead dies

Inventors: Melissa D. Boyd, Timothy Beerling, Timothy L. Weber
Patented Case View Patent ↗
Granted: Nov 27, 2001 Filed: Dec 17, 1998
Inventors
Melissa D. Boyd
Timothy Beerling
Timothy L. Weber
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 6,322,206
App. No.
09/216,606
Filed
1998-12-17
Granted
2001-11-27
Kind
A