Granted Patent
Utility
US 6,325,644 · App. 09/284,230
High density connector and method of manufacture
Inventors:
Timothy A. Lemke, Timothy W. Houtz
Patented Case
View Patent ↗
Granted: Dec 4, 2001
Filed: Jul 7, 1999
Inventors
Timothy A. Lemke
Timothy W. Houtz
Assignee (at issue)
Berg Technology, Inc
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.