Granted Patent
Utility
US 6,326,241 · App. 08/999,153
Solderless flip-chip assembly and method and material for same
Inventors:
Robert Edward Belke, Brian John Hayden, Cuong Pham, Rosa Lynda Nuno, Michael George Todd
Patented Case
View Patent ↗
Granted: Dec 4, 2001
Filed: Dec 29, 1997
Inventors
Robert Edward Belke
Brian John Hayden
Cuong Pham
Rosa Lynda Nuno
Michael George Todd
Assignee (at issue)
Visteon Global Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.