Granted Patent
Utility
US 6,326,301 · App. 09/352,134
Method for forming a dual inlaid copper interconnect structure
Inventors:
Suresh Venkatesan, Bradley P. Smith, Mohammed Rabiul Islam
Patented Case
View Patent ↗
Granted: Dec 4, 2001
Filed: Jul 13, 1999
Inventors
Suresh Venkatesan
Bradley P. Smith
Mohammed Rabiul Islam
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.