Granted Patent
Utility
US 6,326,697 · App. 09/208,906
Hermetically sealed chip scale packages formed by wafer level fabrication and assembly
Inventor:
Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Dec 4, 2001
Filed: Dec 10, 1998
Inventor
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.