Granted Patent
Utility
US 6,328,872 · App. 09/285,621
Method and apparatus for plating and polishing a semiconductor substrate
Inventors:
Homayoun Talieh, Cyprian Emeka Uzoh
Patented Case
View Patent ↗
Granted: Dec 11, 2001
Filed: Apr 3, 1999
Inventors
Homayoun Talieh
Cyprian Emeka Uzoh
Assignee (at issue)
Nutool, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.