Granted Patent
Utility
US 6,329,706 · App. 09/644,097
Leadframe using chip pad as heat conducting path and semiconductor package adopting the same
Inventor:
Shi-back Nam
Patented Case
View Patent ↗
Granted: Dec 11, 2001
Filed: Aug 23, 2000
Inventor
Shi-back Nam
Assignee (at issue)
Fairchild Korea Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.