IP Library › Granted Patent US 6,330,164
Granted Patent Utility
US 6,330,164 · App. 09/114,589

Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device

Inventors: Igor Y. Khandros, David V. Pedersen, Benjamin N. Eldridge, Richard S. Roy, Gaetan L. Mathieu
Patented Case View Patent ↗
Granted: Dec 11, 2001 Filed: Jul 13, 1998
Inventors
Igor Y. Khandros
David V. Pedersen
Benjamin N. Eldridge
Richard S. Roy
Gaetan L. Mathieu
Assignee (at issue)
FormFactor, Inc.

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Quick Facts
Patent No.
US 6,330,164
App. No.
09/114,589
Filed
1998-07-13
Granted
2001-12-11
Kind
A