Granted Patent
Utility
US 6,331,139 · App. 09/795,283
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
Inventors:
Michael A. Walker, Karl M. Robinson
Patented Case
View Patent ↗
Granted: Dec 18, 2001
Filed: Feb 27, 2001
Inventors
Michael A. Walker
Karl M. Robinson
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.