Granted Patent
Utility
US 6,333,255 · App. 09/137,150
Method for making semiconductor device containing low carbon film for interconnect structures
Inventor:
Mitsuru Sekiguchi
Patented Case
View Patent ↗
Granted: Dec 25, 2001
Filed: Aug 20, 1998
Inventor
Mitsuru Sekiguchi
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.