IP Library › Granted Patent US 6,334,247
Granted Patent Utility
US 6,334,247 · App. 08/872,519

High density integrated circuit apparatus, test probe and methods of use thereof

Inventors: Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker
Patented Case View Patent ↗
Granted: Jan 1, 2002 Filed: Jun 11, 1997
Inventors
Brian S. Beaman
Keith E. Fogel
Paul A. Lauro
Maurice Heathcote Norcott
Da-Yuan Shih
George F. Walker
Assignee (at issue)
International Business Machines Corporation

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Quick Facts
Patent No.
US 6,334,247
App. No.
08/872,519
Filed
1997-06-11
Granted
2002-01-01
Kind
B1