Granted Patent
Utility
US 6,337,228 · App. 09/310,660
Low-cost printed circuit board with integral heat sink for semiconductor package
Inventors:
Frank J. Juskey, John R. McMillan, Ronald Patrick Huemoeller
Patented Case
View Patent ↗
Granted: Jan 8, 2002
Filed: May 12, 1999
Inventors
Frank J. Juskey
John R. McMillan
Ronald Patrick Huemoeller
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.