Granted Patent
Utility
US 6,338,980 · App. 09/630,682
Method for manufacturing chip-scale package and manufacturing IC chip
Inventor:
Tetsuo Satoh
Patented Case
View Patent ↗
Granted: Jan 15, 2002
Filed: Aug 1, 2000
Inventor
Tetsuo Satoh
Assignee (at issue)
CITIZEN WATCH CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.