Granted Patent
Utility
US 6,338,984 · App. 09/771,548
Resin-molded semiconductor device, method for manufacturing the same, and leadframe
Inventors:
Masanori Minamio, Kunikazu Takemura, Yuichiro Yamada, Fumito Ito, Takahiro Matsuo
Patented Case
View Patent ↗
Granted: Jan 15, 2002
Filed: Jan 30, 2001
Inventors
Masanori Minamio
Kunikazu Takemura
Yuichiro Yamada
Fumito Ito
Takahiro Matsuo
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.