Granted Patent
Utility
US 6,339,337 · App. 09/048,045
Method for inspecting semiconductor chip bonding pads using infrared rays
Inventors:
Shuichi Matsuda, Keiichiro Kata, Ryoji Sato, Masaharu Sato
Patented Case
View Patent ↗
Granted: Jan 15, 2002
Filed: Mar 26, 1998
Inventors
Shuichi Matsuda
Keiichiro Kata
Ryoji Sato
Masaharu Sato
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.