Granted Patent
Utility
US 6,340,630 · App. 09/536,557
Method for making interconnect for low temperature chip attachment
Inventors:
Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr, William T. Motsiff, Carlos J. Sambucetti
Patented Case
View Patent ↗
Granted: Jan 22, 2002
Filed: Mar 28, 2000
Inventors
Daniel G. Berger
Guy Paul Brouillette
David Danovitch
Peter A. Gruber
Bruce Lee Humphrey
Michael Liehr
William T. Motsiff
Carlos J. Sambucetti
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.