Granted Patent
Utility
US 6,340,792 · App. 08/841,573
Mold cap for semiconductor device mold package
Inventor:
Tomoaki Hirokawa
Patented Case
View Patent ↗
Granted: Jan 22, 2002
Filed: Apr 30, 1997
Inventor
Tomoaki Hirokawa
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.