IP Library Granted Patent US 6,344,234
Granted Patent Utility
US 6,344,234 · App. 08/476,475

Method for forming reflowed solder ball with low melting point metal cap

Inventors: Hormazdyar M. Dalal, Alexis Bitaillou, Kenneth Michael Fallon, Gene J. Gaudenzi, Kenneth Robert Herman, Frederic Pierre, Georges Robert
Patented Case View Patent ↗
Granted: Feb 5, 2002 Filed: Jun 7, 1995
Inventors
Hormazdyar M. Dalal
Alexis Bitaillou
Kenneth Michael Fallon
Gene J. Gaudenzi
Kenneth Robert Herman
Frederic Pierre
Georges Robert
Assignee (at issue)
International Business Machines Corporation

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

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Quick Facts
Patent No.
US 6,344,234
App. No.
08/476,475
Filed
1995-06-07
Granted
2002-02-05
Kind
B1