Granted Patent
Utility
US 6,344,371 · App. 09/136,201
Dimensionally stable core for use in high density chip packages and a method of fabricating same
Inventors:
Paul J. Fischer, Robin E. Gorrell, Mark F. Sylvester
Patented Case
View Patent ↗
Granted: Feb 5, 2002
Filed: Aug 19, 1998
Inventors
Paul J. Fischer
Robin E. Gorrell
Mark F. Sylvester
Assignee (at issue)
W. L. Gore & Associates, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.