Granted Patent
Utility
US 6,344,683 · App. 09/393,184
Stacked semiconductor package with flexible tape
Inventor:
Sun-Dong Kim
Patented Case
View Patent ↗
Granted: Feb 5, 2002
Filed: Sep 10, 1999
Inventor
Sun-Dong Kim
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.