Granted Patent
Utility
US 6,344,696 · App. 09/166,176
Chip size package semiconductor device and method of forming the same
Inventors:
Hirofumi Nakamura, Masamoto Tago
Patented Case
View Patent ↗
Granted: Feb 5, 2002
Filed: Oct 5, 1998
Inventors
Hirofumi Nakamura
Masamoto Tago
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.