Granted Patent
Utility
US 6,348,301 · App. 09/427,793
Method of reducing a critical dimension of a patterned photoresist layer
Inventor:
Chih-Yung Lin
Patented Case
View Patent ↗
Granted: Feb 19, 2002
Filed: Oct 27, 1999
Inventor
Chih-Yung Lin
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.