Granted Patent
Utility
US 6,350,690 · App. 09/288,646
Process for achieving full global planarization during CMP of damascene semiconductor structures
Inventors:
Gary Paul Schwartz, Ramachandran Muralidhar, Stephen W. Hymes
Patented Case
View Patent ↗
Granted: Feb 26, 2002
Filed: Apr 9, 1999
Inventors
Gary Paul Schwartz
Ramachandran Muralidhar
Stephen W. Hymes
Assignees (at issue)
Advanced Micro Devices, Inc.
Agere Systems Guardian Corporation
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.