Granted Patent
Utility
US 6,352,877 · App. 09/696,200
Metal layer in semiconductor device and method for fabricating the same
Inventor:
Dae Gun Yang
Patented Case
View Patent ↗
Granted: Mar 5, 2002
Filed: Oct 26, 2000
Inventor
Dae Gun Yang
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.