Granted Patent
Utility
US 6,353,202 · App. 09/491,117
Apparatus and method for producing a chip-substrate connection
Inventors:
Stefan Grötsch, Hans-Ludwig Althaus, Werner Spath, Georg Bogner
Patented Case
View Patent ↗
Granted: Mar 5, 2002
Filed: Jan 24, 2000
Inventors
Stefan Grötsch
Hans-Ludwig Althaus
Werner Spath
Georg Bogner
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.