IP Library › Granted Patent US 6,355,153
Granted Patent Utility
US 6,355,153 · App. 09/398,258

Chip interconnect and packaging deposition methods and structures

Inventors: Cyprian Emeka Uzoh, Homayoun Talieh, Bulent M. Basol
Patented Case View Patent ↗
Granted: Mar 12, 2002 Filed: Sep 17, 1999
Inventors
Cyprian Emeka Uzoh
Homayoun Talieh
Bulent M. Basol
Assignee (at issue)
Nutool, Inc.

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Quick Facts
Patent No.
US 6,355,153
App. No.
09/398,258
Filed
1999-09-17
Granted
2002-03-12
Kind
B1