Granted Patent
Utility
US 6,355,504 · App. 09/599,161
Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive
Inventor:
Tongbi Jiang
Patented Case
View Patent ↗
Granted: Mar 12, 2002
Filed: Jun 21, 2000
Inventor
Tongbi Jiang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.