Granted Patent
Utility
US 6,358,840 · App. 09/655,699
Forming and filling a recess in interconnect with alloy to minimize electromigration
Inventors:
Pin-Chin Connie Wang, Christy Mei-Chu Woo
Patented Case
View Patent ↗
Granted: Mar 19, 2002
Filed: Sep 6, 2000
Inventors
Pin-Chin Connie Wang
Christy Mei-Chu Woo
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.