IP Library Granted Patent US 6,359,307
Granted Patent Utility
US 6,359,307 · App. 09/493,436

Method for forming self-aligned contacts and interconnection lines using dual damascene techniques

Inventors: Fei Wang, Hiroyuki Kinoshita, Kashmir Sahota, Yu Sun, Wenge Yang
Patented Case View Patent ↗
Granted: Mar 19, 2002 Filed: Jan 29, 2000
Inventors
Fei Wang
Hiroyuki Kinoshita
Kashmir Sahota
Yu Sun
Wenge Yang
Assignee (at issue)
Advanced Micro Devices, Inc.

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Quick Facts
Patent No.
US 6,359,307
App. No.
09/493,436
Filed
2000-01-29
Granted
2002-03-19
Kind
B1