Granted Patent
Utility
US 6,360,934 · App. 09/502,188
Apparatus and method for removing a soldered device from a printed circuit board
Inventors:
Michael C. Cilia, Gurpreet S. Dayal, Don Nguyen, Arthur K. May
Patented Case
View Patent ↗
Granted: Mar 26, 2002
Filed: Feb 10, 2000
Inventors
Michael C. Cilia
Gurpreet S. Dayal
Don Nguyen
Arthur K. May
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.