Granted Patent
Utility
US 6,364,751 · App. 09/546,421
Method for singling semiconductor components and semiconductor component singling device
Inventors:
Jens Pohl, Oliver Wutz, Johann Winderl
Patented Case
View Patent ↗
Granted: Apr 2, 2002
Filed: Apr 10, 2000
Inventors
Jens Pohl
Oliver Wutz
Johann Winderl
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.