Granted Patent
Utility
US 6,365,069 · App. 09/879,327
Process of injection molding highly conductive molding compounds and an apparatus for this process
Inventors:
Kurt I. Butler, Daniel Thomas
Patented Case
View Patent ↗
Granted: Apr 2, 2002
Filed: Jun 12, 2001
Inventors
Kurt I. Butler
Daniel Thomas
Assignee (at issue)
QUANTUM COMPOSITES, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.