Granted Patent
Utility
US 6,365,439 · App. 09/770,494
Method of manufacturing a ball grid array type semiconductor package
Inventors:
Chuichi Miyazaki, Yukiharu Akiyama, Masanori Shibamoto, Tomoaki Kudaishi, Ichiro Anjoh, Kunihiko Nishi, Asao Nishimura, Hideki Tanaka, Ryosuke Kimoto, Kunihiro Tsubosaki, Akio Hasebe
Patented Case
View Patent ↗
Granted: Apr 2, 2002
Filed: Jan 29, 2001
Inventors
Chuichi Miyazaki
Yukiharu Akiyama
Masanori Shibamoto
Tomoaki Kudaishi
Ichiro Anjoh
Kunihiko Nishi
Asao Nishimura
Hideki Tanaka
Ryosuke Kimoto
Kunihiro Tsubosaki
Akio Hasebe
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.