Granted Patent
Utility
US 6,365,839 · App. 09/587,307
Multi-layer printed circuit board with dual impedance section
Inventors:
Eric Robbins, Stephen W. Berry
Patented Case
View Patent ↗
Granted: Apr 2, 2002
Filed: Jun 5, 2000
Inventors
Eric Robbins
Stephen W. Berry
Assignee (at issue)
Adaptec, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.