Granted Patent
Utility
US 6,367,150 · App. 09/148,506
Solder flux compatible with flip-chip underfill material
Inventor:
Kenneth John Kirsten
Patented Case
View Patent ↗
Granted: Apr 9, 2002
Filed: Sep 4, 1998
Inventor
Kenneth John Kirsten
Assignee (at issue)
NORTHROP GRUMMAN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.