Granted Patent
Utility
US 6,371,833 · App. 09/438,305
Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer
Inventors:
Kai Huckels, Klaus Herlitz
Patented Case
View Patent ↗
Granted: Apr 16, 2002
Filed: Sep 13, 1999
Inventors
Kai Huckels
Klaus Herlitz
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.