Granted Patent
Utility
US 6,372,997 · App. 09/513,483
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
Inventors:
Richard F. Hill, Forest Hampton, III
Patented Case
View Patent ↗
Granted: Apr 16, 2002
Filed: Feb 25, 2000
Inventors
Richard F. Hill
Forest Hampton, III
Assignee (at issue)
Thermagon, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.