Granted Patent
Utility
US 6,375,063 · App. 09/354,825
Multi-step stud design and method for producing closely packed interconnects in magnetic recording heads
Inventors:
Vijay K. Basra, Lawrence G. Neumann
Patented Case
View Patent ↗
Granted: Apr 23, 2002
Filed: Jul 16, 1999
Inventors
Vijay K. Basra
Lawrence G. Neumann
Assignee (at issue)
Quantum Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.