Granted Patent
Utility
US 6,375,365 · App. 09/514,424
Apparatus and packaging method to assemble optical modules to a common substrate with adjustable plugs
Inventor:
Kelvin Chau
Patented Case
View Patent ↗
Granted: Apr 23, 2002
Filed: Feb 28, 2000
Inventor
Kelvin Chau
Assignee (at issue)
Onix Microsystems
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.