Granted Patent
Utility
US 6,375,549 · App. 09/527,859
Polishing head for wafer, and method for polishing
Inventors:
Walter Glashauser, Lutz Teichgräber, David Weston Haggart, Jr., Katrin Ebner
Patented Case
View Patent ↗
Granted: Apr 23, 2002
Filed: Mar 17, 2000
Inventors
Walter Glashauser
Lutz Teichgräber
David Weston Haggart, Jr.
Katrin Ebner
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.