Granted Patent
Utility
US 6,376,355 · App. 09/136,798
Method for forming metal interconnection in semiconductor device
Inventors:
Mee-Young Yoon, Sang In Lee
Patented Case
View Patent ↗
Granted: Apr 23, 2002
Filed: Aug 19, 1998
Inventors
Mee-Young Yoon
Sang In Lee
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.