IP Library Granted Patent US 6,376,375
Granted Patent Utility
US 6,376,375 · App. 09/482,777

Process for preventing the formation of a copper precipitate in a copper-containing metallization on a die

Inventors: Melody G Hewitt-Bell, Steven Michael Stansberry
Patented Case View Patent ↗
Granted: Apr 23, 2002 Filed: Jan 13, 2000
Inventors
Melody G Hewitt-Bell
Steven Michael Stansberry
Assignee (at issue)
Delphi Technologies

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Quick Facts
Patent No.
US 6,376,375
App. No.
09/482,777
Filed
2000-01-13
Granted
2002-04-23
Kind
B1