Granted Patent
Utility
US 6,376,797 · App. 09/626,708
Laser cutting of semiconductor materials
Inventors:
Bernhard P. Piwczyk, Juris P. Kalejs
Patented Case
View Patent ↗
Granted: Apr 23, 2002
Filed: Jul 26, 2000
Inventors
Bernhard P. Piwczyk
Juris P. Kalejs
Assignee (at issue)
ASE Americas, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.