Granted Patent
Utility
US 6,380,494 · App. 09/559,310
Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board
Inventors:
Allen Thomas Mays, Kris Allan Slesinger, Michael C. Weller
Patented Case
View Patent ↗
Granted: Apr 30, 2002
Filed: Apr 27, 2000
Inventors
Allen Thomas Mays
Kris Allan Slesinger
Michael C. Weller
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.