Granted Patent
Utility
US 6,394,334 · App. 09/536,810
Method and apparatus for forming solder bumps
Inventors:
Guy Paul Brouillette, Peter A. Gruber, Frederic Maurer
Patented Case
View Patent ↗
Granted: May 28, 2002
Filed: Mar 28, 2000
Inventors
Guy Paul Brouillette
Peter A. Gruber
Frederic Maurer
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.